IntroductionofHalogenfree英文.ppt

* What is the difference among the methods? The form of halogen in flux/solder paste --- Inorganic halogen compound (Ionic halogen )---can be detected by IC --- Organic halogen compound (Covalent halogen )--- can not be detected by IC Halogen content detected by IC Combust Extract by DI water or IPA Ionic halogen in inorganic halogen compound Ionic halogen converted from organic halogen compound Pretreatment vs Halogen content Cl Br EN14582 ND 532 IPC TM650 ND 270 Example: Solder paste * Adhesive materials 3rd party laboratory use EN14582:2007 because it’s combustible in oxygen. Does the sample state (Cured or Uncured) affect the result? Cl Br Cured sample 28896 ppm ND Uncured sample 29492 ppm ND Example: Chipbonder No obvious difference! * Most of adhesive TDS specify one property for cured sample: Extractable ionic content including --- Chloride (Cl-) --- Sodium (Na+) --- Potassium (K+) Why extractable ionic content must be specified? It’s not halogen-free consideration but reliability consideration. Metal corrosion and metal migration are the two reliability issues. If excess ionic materials such as chloride and sodium are available in adhesive, it will accelerate metal corrosion and metal migration. So MIL-STD-883E method 5011.4 (Evaluation and acceptance procedures for polymeric materials) establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit application. Adhesive materials * * CFCHCFC: 破坏臭氧层，用于冷媒，隔热材料。化学性质不活泼，在它们被破坏之前在大气中可滞留100－200年. PFOS:纺织品，皮革等表面防污处理剂，应用于微电子零配件生产中的光刻胶和部件清洗过程。 PVC: 聚氯乙烯，用途广泛的塑料。生产过程中含有有害物质：氯乙烯－－致癌物质；大量使用Pb或Cd系列的稳定剂；邻苯二甲酸脂类增塑剂－－影响儿童发育 * * PBB:聚溴联苯， PBDE:聚溴二苯醚， PCB:PCT:HBCDD:六溴环十二烷（阻燃剂）， TBBPA:四溴双酚A （阻燃剂）, * * * * IPC4101B: Specification for Base Materials for Rigid and Multilayer Printed Boards * * * * C509-2 * * C509-2 * * C509-2 * * C509-2 * * C509-2 * * * * Endorser 1 Endorser 2 http://www.HTKSMT.com * W