多层PCB信号完整性建模与边界元数值分析-机械设计及理论专业论文.docxVIP

II II Signal Integrity Model of Multilayer PCB and Boundary Element Method Numerical Analysis Abstract Nowadays, under the trend of Electronic products are miniaturization、high speed and high density, which lead to the number of layers and vias are increasing in High-speed printed circuit board (PCB). Under the condition of high frequency, the parasitic effect is more complicated than the low frequency, at the same time the parasitic effect has become the important factors of affecting the signal transmission quality in the high speed PCB. Meanwhile, the high-speed signal through the interconnect lines will produce some signal integrity trouble, such as delay, reflection, crosstalk, attenuation and dispersion. Predicting the influence of via and modeling for vias have become very important component in the process of high-speed PCB design. In addition, these directly affect the success or failure of high speed digital system design. In this paper, the boundary element method was used to mode, simulate and analysis resonator structure，which is composed of power/ground plane. According to the analysis of the field distribution within the power/ground plane, the complex 3-d problems convert to 2-d problem. Study numerical method of the return path input impedance on power/ground plane, which containing some vias , shorting vias and shorting via ,which are located around the signal via. First of all, according the vias and interconnect structure on multilayer PCB to modeling equivalent circuit, using transmission line theory and PSPICE prediction crosstalk between different microstrip at the source side line. Second, using the boundary element numerical method to calculate the return path impedance and apply PSPICE (ADS) to simulating reflection coefficient and transmission coefficient. In the meantime, analyze the influence of parameters of via, the number of shorting via and the gap between signal via and shorting vias for signal transmission. At last , through the HF