高密封装用钎焊球制备技术及工艺研究-材料加工工程专业论文.docxVIP

摘要 过程中，射流断裂长度越来越大。在一定温度范围内提高激振频率，降低钎料熔 融温度或射流压强，有利于射流均匀断裂，减小钎焊球直径，提高焊球质量。根 据上述工艺参数影响规律，选择合适的钎料熔融温度、喷射压强、激振频率和球 化介质环境，可以实现各种规格焊球的制作。 关 键 词：球栅阵列，钎焊球，激振喷射，喷射压强，真球度 论文类型：应用基础研究 II 摘 要 Subject: Production Technique and Technics Study of Solder Balls Used by the High Integrated Package Specialty: Material Processing Engineering Name: Guo Xiao-xiao Supervisor: Yan Yan-fu ABSTRACT Electronic products have been developing to portable type, miniaturization, networking and multimediafication. The high integrated package technology of electronic products is demanded higher and higher. BGA (Ball Grid Array) package is one of the most advancing and mature surface package methods using solder balls to replace the down-lead of the packaging configuration in the IC component. The solder ball is the key material of the bump fabrication in the BGA and μBGA high integrated package. The small solder balls are used to form both the signal transmission path and the mechanical connections between the chip and the printed circuit board (PCB) in BGA package. According to the theory and process of fabricating solder ball by fine wire cutting–remelting method, an equipment manufacturing solder balls, which is made up of automation cutting equipment, preheating system, remelting spheroidization system, cooling system, control system and collecting system was designed. Analyzing the functions and action principles of every components and regulating cutting equipment, all kinds of solder balls can been produced by the equipment. The influence of the nodulizer types, preheating temperatures and spheroidization temperatures on real sphericity and surface appearance of the solder balls are investigated. Results show that the real sphericity of the 63Sn37Pb solder balls is the maximum and the surface quality of the solder balls is the best when the arachis oil is used as the nodulizer. That is to say, the spheroidization effect of arachis oil is the best, followed by silicone oil ,