高密度封装工艺中芯片拾放机械手设计-机械电子工程专业论文.docxVIP

`华中科技 大学 `华 中 科 技 大 学 硕 士 学 位 论 文 II万方数据 II 万方数据 Abstract Nowdays the development of IC packaging industry is rapid. More and more high-density chips are put into use. So it is imminent to study for high-density chip packaging process. This paper studies for chip pick-and-place manipulator in high-density flip-chip bonding process, focusing on its design, kinematics modeling and analysis, error modeling and analysis, parameters calibration and validation and so on. Firstly, make it clear about the requirements of the process, do principle design of the manipulator. The flip-chip bonding technology which is based on ACA (anisotropic conductive adhesive), includes dispensing, correcting posture, placement and other process. The chip pick-and-place manipulator is mainly responsible for the leveling function in correcting posture position procedure. Based on the analysis and synthesis of the leveling mechanism, the leveling mechanism is designed as the rotational decoupled parallel mechanism of two DOF. After precision calculations and strength analysis, the manipulator’s model is designed which contains bonding head and other components. Secondly, the kinematics modeling of the manipulator is established by using the geometric method. Based on the kinematics model of leveling mechanism, the mathematical model of chip angle adjustment device is established, completing the direct correspondence between the chip angle adjustment quantity and the input of the leveling mechanism, which is convenient to controlling. Then the error modeling of the linkages in leveling mechanism is established based on the perturbation method, and the sensitivity of the output angle for the error of rod length is analyzed, revealing the effect of processing and assembly error to the precision of leveling mechanism . At last, calibrate the kinematics parameters of the manipulator. Combining manipulator kinematics model and error model, measuring the manipulator’s leveling accurac