分子结构对硫脲类化合物在铜表面自组装能力的影响Influenceof.PDF

2007 年第 65 卷 化 学 学 报 Vol. 65, 2007 第 5 期, 390～394 ACTA CHIMICA SINICA No. 5, 390～394 ·研究论文· 分子结构对硫脲类化合物在铜表面自组装能力的影响 王春涛*,a 陈慎豪b a ( 太原师范学院化学系 太原 030031) (b 山东大学化学与化工学院 济南 250100) 摘要 利用电化学阻抗谱和极化曲线研究了硫脲、烯丙基硫脲、苯基硫脲在金属铜表面上的自组装膜的质量和缓蚀效 率, 并通过量子化学计算进一步研究了各种分子和金属铜的相互作用. 结果表明硫脲类分子在金属铜表面上的成膜能 力顺序为: 苯基硫脲＞烯丙基硫脲＞硫脲, 并揭示了分子结构对硫脲类化合物在金属铜表面自组装影响的本质, 为进 一步寻找和制备优良的缓蚀功能自组装膜提供理论依据. 关键词 硫脲; 自组装; 缓蚀 Influence of Thiourea Molecular Structure on Its Self-assembled Ability onto Copper Surface WANG, Chun-Tao*,a CHEN, Shen-Haob a ( Department of Chemistry, Taiyuan Normal College, Taiyuan 030031) (b School of Chemistry and Chemical Engineering, Shandong University, Jinan 250100) Abstract The quality and inhibition efficiency of thiourea (TU), allylthiourea (AT) and phenylthiourea (PT) self-assembled films were studied by electrochemical impedance spectroscopy and polarization curves, respectively. Quantum chemical calculations were performed to investigate interactions between copper and thioureas. The self-assembled ability order of thioureas onto copper was obtained, which is PT ＞A ＞TU. The structural essential of thioureas self-assembled on copper was revealed, which can provide a theoretical basis for looking for and preparing more inhibitive self-assembled films. Keywords thiourea; self-assembly; inhibition 多年来, 硫脲(TU)在各种金