镍钴钯镀层的防铜渗性能比较.PDF

·　4 · Aug.2000 　 　 Electroplating　　Finishing 　 　 Vol.19 No.4 :　1001-227X(2000)04-0004-04 、、 吴永火斤, 　文效忠, 　杨志雄, 　萧祖隆, 　李志勇 (香港理工大学,香港) :以镍、钴、钯镀层作为铜基体镀金的防渗铜中 层可以有效地防止铜原子扩散 到金属表面。采用SEM 、EDAX、XRD 等方法研究铜在该3 种金属内的扩散机理和扩 散系数,探讨了扩散过程与这3 种金属晶体结构、晶粒大小以及X-射线衍射特性的 关系。 :金属扩散;　防铜渗镀层;　镍;　钴;　钯;　电镀 :TG111.6;TQ153　　　　　　　:A A comparative study on migratory properties of copper in nickel, cobalt and palladium deposits WU Yong-xin, WEN Xiao-zhong, YANG Zhi-xiong, X AO Zu-long, L Zhi-yong (Hong Kong Polytechnic University, Hong Kong) Abstract:Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold de- posit can effectively reduce migration of copper atom to gold upper deposit.The diffusion mechanism and diffu- sion coefficient of copper in the three metals were studied by means of SEM, EDAX and X-ray diffraction. The relationship between the diffusion process and the crystalline structure, grain size, X-ray diffraction prop- erties of the three metals were also discussed. Keywords:metal diffusion;copper barrier layer;nickel;cobalt;palladium;electroplating 。, 1　 , 。 , 　　 。, ,、、、、 , , , ,,, 。, 。90 , , 2 [1] , , 0.5 μg/cm /w 。 1999 , 　:2000-05-16 :EN 1811 EN12472。 :, , , 、, 2000 8 　 　 　 　 19 4 ·　5 · 1 。 。 X -