晶片级封装的可靠性分析-微电子学与固体电子学专业论文.docxVIP

A A B S T R A C T doub le b eam are eom P ared w ith ex P erim en tal m easurem en ts to v erify th e m od el. B oth C o f fi n 一M a n so n a n d M o d if ie d C o f fi n 一M a n so n e q u a tio n s a re u se d to P re d ie t th e f atig u e life of so ld er jo in ts o n th e P aek ag e u n d er tem P erature ey cle test.F urt h erm o re，th e effe et o f so ld e r b a ll la y o u t a n d stre ss re la x b u f fe r la y er m a te r ia l o n th e f atig U e lif e o f so ld er jo in ts 15 stud ied . K e yw o rd s : L e v e l P a e k a g in g ，T h e r m a l F a ti