基于PDP扫描驱动芯片的LQFP封装热特性探究.pdfVIP

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基于PDP扫描驱动芯片的LQFP封装热特性探究.pdf

第36卷第4期 电子器件 V01.36No.4 0f 2013年8月 CIIine辩Jo哪alElectmnDevices Aug.2013 4 Scall蹦verICs 蝴‰岫L呷m删锄绌觚酬伽PDP YU Dt,uU B讥g。ZHANGs时Gmg,sUNWe诈ng’ (№幻,以AS,c跏加lE研,w^ng‰^∞垤y胍∞砌&眦er,Somk∞I‰沁m渺,肫,彬ng21(X)96,∞iM) of96 diverICshas intotlletIlemalchamcteristics PDP(PlasmaDisplayPanel)scan Abstract:Investigation outputs been finiteeleInentmethodtoobtainnumericalsolutionof出eestablishedmodel. c痂ed package out,using themeasured verifiesthe and ofthemodel-Theresearchshows reliability Compared沥t}l results。it accuracy that,in aIld the of theareaofdie the ofleadf}咖e themal designICs,expaIlding pad,optimizingsh印e increasing package ofthe contributetothe of the circuit peripheral conductivitypackage improVementchipcoolingperfbnnance.In thee伍cientareaof ofViaholesof CiI℃uit Board),air design,increasing copper,number PCB(Printed Velocity,and aheatSinkmountedont}Ie of areaUefEcient canenhancethe of adding top chip means,which capabilitychip coolingsigIlificandy. element scandriver method;PDP K

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