微桥结构Ni膜杨氏模量和残余应力研究-现代科学仪器网.PDFVIP

E-mail: yzhou@mail.sjtu.edu.cn Ni MEMS TP115.9 Measurement of Young’s Modulus and Residual Stress of Nickel Film Microbridges by MEMS Technology Zhou Yong, Wang Mingjun, Yang Chunsheng, Chen Ji’an, Wang Li, Ding Guifu, Zhang Yamin, Gao Xiaoyu (National Key Laboratory of Micro/Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education,Shanghai Jiao Tong University, Shanghai 200030, China) Zhang Tai Hua (State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, China) Abstract The Microbridge testing method is used to measure the Young’s modulus and residual stresses of metallic films. Samples of nickel film microbridges are fabricated by the MEMS (Microelectromechanical Systems)technology. Special ceramic shaft structure is designed to solve the problem of getting the load-deflection curves of Ni microbridge by Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of the microbridge load-deflection curve is proposed to evaluate the Young’s modulus and residual stress of the films simultaneously. The calculated results based on experimental measure- ments show that the average Young’s modulus and residual stress for the electroplated nickel films are: 190.5 GPa and 146 MPa, respectively, while the Young’s modulus measured by nano-hardness method on the