含裂纹和弱界面结构断裂分析中的辛方法-固体力学专业论文.docx

含裂纹和弱界面结构断裂分析中的辛方法-固体力学专业论文.docx

含裂纹和弱界面结构断裂分析中的辛方法(3)将弱界面模型引入到电磁弹性材料反平面断裂问题中,并采用辛方法对多场耦 含裂纹和弱界面结构断裂分析中的辛方法 (3)将弱界面模型引入到电磁弹性材料反平面断裂问题中,并采用辛方法对多场耦 合作用情况进行求解。首先,采用能量方法和勒让德变换,确定原变量(位移、电势和 磁势)的对偶变量(应力、电位移、磁感应强度),从而将问题导入到哈密顿体系中。 然后,以弹簧模型作为弱连接条件的数学模型,结合不同的力学、电学、磁学裂纹面条 件,推导出弹簧模型连接的两区域内的辛本征解向量和共用的辛本征值,并验证全域内 辛本征解之间存在辛共轭正交关系。最后,利用外边界条件和辛共轭正交关系,确定问 题解的解析表达式以及断裂参数。数值结果表明,由于弱连接界面的存在,使得广义强 度因子分为两类,且弱界面参数影响强度因子的大小,而裂纹面条件影响广义强度因子 的存在与否。 关键词:哈密顿体系;粘弹性;弱界面;强度因子 万方数据 大连理工大学博士学位论文ABSTRACT 大连理工大学博士学位论文 ABSTRACT The advanced composite materials play an important role in the national development because of the development of materials science and manufacturing processes。The functional materials which possess two or more characteristics of power-electricity—magnetic—heat— sound and light etc.,such as polymer-based composite materials,piezoelectric materials, magnetic materials and photovoltaic etc.are widely used in aerospace,construction industry, electronic industry and medical equipment fields and any other fields.Wherein the laminate structure which bonded by many single plates with polymer is a typical structure,debonding becomes the main failure mode of such structure.Therefore,the study of viscoelastic fracture and electro—magnetic coupling problems is necessary. The current research methods of fracture problem are analytical method(complex potential method,integral transform method,weight function method,etc.)and numerical methods(finite element method,boundary element method,mesh free method,etc.).Analytical research methods are mainly attributed to the solving of higher order partial differential or integral equation.They reduce the number of variables by means of improving the order of control differential equations,but the solving of high-order differential equations is difficult, and this is the limitation of the Lagrangian system.In this case,the Hamiltonian system is employed in this paper,the symplectic method which reduce the order of differential equations by increasing the number of variables and high

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