具有不同交联结构和固化行为的苯并环丁烯树脂制备及其热稳定性研究-化学专业毕业论文.docxVIP

西南科技大学硕士研究生学位论文第 西南科技大学硕士研究生学位论文 第 PAGE II页 西南科技大学硕士研究生学位论文第 西南科技大学硕士研究生学位论文 第 PAGE III页 的应用潜力。 关键词：苯并环丁烯 交联 Heck 偶联 阴离子聚合 热固性树脂 Abstract It is known that benzocyclobutene (BCB) resins possess many advantages, such as low dielectric costant, outstanding film-forming performance and low moisture absorption, especially are widely used in microelectronics field. The production of Integrated Circuit (IC) molding process need to experience the annealing treatment in 400℃, but the thermal stability of lots of dielectric materials doesnt meet the requirement of the packaging process