铝基板大功率LED封装结构设计及光热可靠性研究-机械电子工程专业毕业论文.docxVIP

摘 摘 要 Abstract Abstract I万方数据 I 万方数据 PAGE IV PAGE IV 万方数据 摘 要 本文以铝基板大功率 LED 封装结构设计及光热可靠性研究为背景，采用了实 验与软件仿真相结合的研究方法。本文的研究结果可为铝基板大功率 LED 封装结 构设计及光热可靠性研究提供相关理论基础、实验方法和仿真分析方法。 首先，阐述了 LED 器件的发光原理，介绍了铝基板大功率 LED 封装的基本结 构，详述了芯片衬底材料、基板材料、鳍片式散热器以及功率型 LED 常见失效形 式等内容。其次，对 4 芯片 3W 浅方杯铝基板大功率 LED 封装结构进行了初步设 计，初步设计包括：封装材料的优选和光学透镜的仿真设计。随后，选取 1W 浅方 杯铝基板大功率 LED 实物进行了热特性实验和仿真研究。实验内容为测试不同结 构参数属性的控温座对 LED 结温及热阻特性的影响。同时，利用有限元分析软件 模拟不同结构参数属性的控温座对 LED 结温的影响，并同实验研究结果进行比较 以验证软件仿真方法的可行性。最后，完成了对 4 芯片 3W 浅方杯铝基板大功率 LED 封装结构的完整设计。 热特性实验和仿真结果均显示：不同结构参数属性的控温座对 LED 结温影响 较大，控温座结构参数越大，其对流换热的能力越强，LED 结温越低。设计结构的 温度场模拟结果和光学设计仿真结果显示：LED 封装结构的散热效果良好，正常工 作状态下芯片结温较低，二次光学的配光效果比较理想，整体封装结构基本满足了 大功率 LED 光热可靠性的设计要求。论文还针对 COB 封装结构的多芯片铝基板大 功率 LED 进行了热循环模拟，目的是检验其在各种温度载荷下，抵御破坏的能力。 模拟结果表明：芯片和共晶焊层交界区域、衬底和铝基板交界处是 COB 封装结构 的多芯片铝基板大功率 LED 热应力破坏最大的区域，而透镜仍是高温下发生热应 变最大的区域，应该引起注意。 关键词：大功率 LED；封装；铝基板；二次光学设计；结温；有限元 Abstract This primary background of this research is based on packaging design and optical thermal reliability study on Aluminum plate high-power LED. According to the characteristics of the technology for high-power LED research, simulation and experimental analysis are carried out. This research can provide the theoretical basis of packaging design and optical thermal reliability study, experimental method and simulation methods. Firstly, the luminous principle of LED is expounded. The basic structure of high power LED packaging and the chips substrate materials, plate materials, fin radiators and the failure forms of power LED are introduced. Secondly, the packaging structure of 4 chips 3W shallow square cup style of Aluminum plate high power LED has been preliminary designed. By using Orthogonal test method for the radiators optimization design, the primary and secondary sequence of factors that effect on the performance of LED cooling and overall quality are found out. At the same time, from the viewpoint of the optical reliability, optical simulation is carried out to realize the LED precise lighting. L