0 材料与人类文明 (信息材料 方吉祥)final-2 .ppt

* * * 2.3 半导体器件历史及类型 ?????????????????????????????????????????????????????????? Intel 8080, 1975, 4,500 transistors Next ... 2.3 半导体器件历史及类型 ????????????????????????????????????????????????????? Intel 8086, 1978, 29,000 transistors Next ... 2.3 半导体器件历史及类型 ??????????????????????????????????????????????????? Intel Pentium Pro, 1995, 5.5 million transistors Next ... 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 /book/book_cklr.asp?lable=878 2.3 半导体器件历史及类型 /book/book_cklr.asp?lable=878 2.3 半导体器件历史及类型 /book/book_cklr.asp?lable=878 /book/book_cklr.asp?lable=878 2.3 半导体器件历史及类型 Design houses Market req.ment Wafer manufers Masking Films Chips plants Package plants Materials supplier Test Market users Feedback analysis 2.3 半导体器件历史及类型 芯片制造 芯片封装 ManufactureWafer Deposition Etching Epitaxy RTP CMP Ion Implantation Assembly, Test CD SEMMetrology DefectDetection Lithography Technologies Mask Defect Detection Mask Pattern Generation Mask Etching 2.3 半导体器件历史及类型 芯片制造工艺流程 ManufactureWafer Die attach Wire bond Wafer saw Plating Test, Assembly Singulation Trim Mold Lead form 2.3 半导体器件历史及类型 芯片封装工艺流程 2.3 半导体器件历史及类型 21st Century Electronics:Transistors at the nano/molecular scale Gate Drain Source ~100 nm Texas Instruments ~2000 ~10 nm ? ~2015 electron flow 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 Interconnection 2.3 半导体器件历史及类型 2.3 半导体器件历史及类型 2.3 IC Nanotechnology P. D. Yang’s group 2.3 IC Nanotechnology ---Wafer Level Packging Microelectronics package technology 2.3 IC Nanotechnology Stacked Die 32Mb PSRAM + 128Mb Flash + 128Mb Flash 8Mb SRAM + 32Mb PSRAM + 128Mb Flash + 128Mb Flash New System Chip Architecture: MDSC (I) Multi-dimensional Die integration System Chips Analog or Cache over SoC Memory + Logic RF or Power e.g. 2.3 IC Nanotechnology New System Chip Architecture: MDSC (II) Metropolitan-like Die-Society Cluster - Conceptualized as la