pcba不良分析解析资料.pptVIP

Defect mode: CleanlinessVersion:不洁Description：洁净度不够，如有助焊剂残留等 Defect mode: cold solderVersion:冷焊 Defect mode: ContaminationVersion:玷污Description：污染 Defect mode: coplanarityVersion:不共面 Defect mode: Defective fan PCBA Version:风扇线路板故障 Defect mode: DelaminationVersion:分层Description：PCB组装后分层 Defect mode: DewettingVersion:去湿Description：焊盘或端子，引脚不沾锡 Defect mode: Excess solderVersion:焊料过多 Defect mode: Excessive lead lengthVersion:引脚过长 Defect mode: Exposed copperVersion:露铜 Defect mode: IcicleVersion:锡尖Description：触点处有遗留焊尖 Defect mode: Incorrect lead formVersion:引脚变形 Defect mode: Insufficient lead Version:引脚不够突出Description：引脚长度不够，未伸出板，不可辨认 Defect mode: Insufficient solderVersion:焊料不足 Defect mode: MisalignmentVersion:方向偏离Description：对位不准 Defect mode: Missing componentVersion:组件缺失Description：缺少零件 Defect mode: Particulate matterVersion:颗粒物质Description：有杂质，有异物 Defect mode: Raised componentVersion:组件突起Description：元件抬高，浮起 Defect mode: Reversed componentVersion:元件装反 Defect mode: Scratches/gougesVersion:划伤，沟槽 Defect mode: Solder ball/splashVersion:锡球/锡渣 Defect mode: Solder beadingVersion:焊锡连珠Description：锡珠 Defect mode: Solder bridgeVersion:锡桥 Defect mode: Solder cavityVersion:焊穴 Defect mode: SolderabilityVersion:可焊性Description：焊接性不好 Defect mode: TombstoningVersion:元件竖立Description：墓碑 Defect mode: unsoldered leadVersion:引脚未焊接 Defect mode: WarpedVersion:扭曲Description：组装后的成品PCBA扭曲，翘曲 Defect mode: Wrong componentVersion:组件错误Description：用错料 Defect mode: Wrong revisionVersion:版次错误 * Defect mode: BURNTVersion:加温过度 *