半导体封装制程与设备材料知识介绍-ppt精编版.pptVIP

Plasma Clean – March AP1000 Key Technology: 1. Argon Condition, No oxidation. 2. Vacuum Pump dust collector. 3. Clean Level : blob Test Angle 8 Degree. Plasma PCB Substrate Die + + + + + + + + + + + + + Electrode + Ar Well Cleaned with Plasma ? 8 o Chip Ar Ar No Clean (Organic Contamination) Well Cleaned with Plasma ? ? 80 o ? 8 o Organic Contamination vs Contact Angle Water Drop Chip Chip Mold(模塑) To mold strip with plastic compound then protect the chip to prevent from damaged --塑封元件的线路，以保护元件免受外力损坏，同时加强元件的物理特性,便于使用.在模塑前要经过等离子清洗(Pre-Mold Plasma Clean),以确保模塑质量.在模塑后要经过模塑