微电阻铜厚测量仪的研制.pdfVIP

微电阻铜厚测量仪的研制 The Development of MRI-Y07A Micro-resistance Copper Thickness Measuring Instrument 1 1 1 2 2 叶道庆 ，陈培峰 ，程凡雄 ，方军良 ，赵丽 1 上海美维科技有限公司 研发部 2 上海美维科技有限公司 中央测试实验室 摘要：在线路板生产过程中，需要对铜层厚度进行测量。目前PCB 企业使用的基本是进口的测厚仪， 为了解决现存仪器测量结果与金相切片结果有一定偏差，人机操作界面不够友好，设备与配件使用 成本较为昂贵的问题，我们研制了MRI-Y07A 型铜厚测量仪。该仪器采用新的三点定标算法，高速 数据卡，综合了28KHZ 采样频率，200ms 防抖控制，自动触发测量功能等方案。对HDI 板铜厚实 测结果误差缩小到4% ，重复精度缩小到1.5%，每次测量时间仅为0.6 秒，而且采用多种数据记录模 式和 EXCEL 表格输出，人性化中文操作界面比进口仪器更方便，各项性能已经达到甚至超过进口 测厚仪水准。 关键词：铜厚测量，四探针法，微电阻，三点定标法， Abstract: In printed circuit board production, the copper layer thickness after thinning or electroplating should be measured. Currently the imported measurement instruments are used in the most PCB shops. In order to decrease the deviation between the instruments measure results and micro-section data, improve the man-machine interface and reduce the running cost, we developed a new micro-resistance copper thickness measurement instrument i.e. MRI-Y07A. The instrument uses three-point calibration algorithm, high-speed data card that combines 28KHZ sampling frequency, 200ms anti-shake control function and automatically triggering measurement program, which not only can speed up the measuring speed, but also ensure accuracy. The measurement error is reduced to 4% and the repeat accuracy is down to 1.5% for the PCB board, especially for the HDI product. Only 0.6 seconds is spent for each measurement. The man-machine interface in Chinese, which has kinds of data recording mode and EXCEL table output, is more convenient than that of imported equipment. Generally speaking, the performance of MRI-Y07A is equivalent to or even exceeded the standards of the imported ones. Keywords: Copper thickness measurement, Four–poi