PCB孔壁断层断裂.pdfVIP

PCB * 523039 PCB 4 1 PCB TQ153.14 A 1004 – 227X (2010) 05 – 0029 – 05 Research on the PCB barrel crack // LI Qin-yuan*, LIU Pan, FENG Ling-yu Abstract: Barrel crack exists in copper deposit in many PCB plants. It is much more difficult to treat than common technical problems because barrel crack is related to many factors, such as material, lamination, drilling, copper plating, and so on. Therefore, there is a high risk of goods returned 1 because of the failure can only be found after SMT (surface Figure 1 Schematic diagram of cause analysis for barrel crack mount technology) by customers. It is proposed that the 2 problem of barrel crack must exist in copper plating process based on analyzing the morphology of defective board and 2. 1 PCB studying the preparation process of PCB with barrel crack. PCB 1 1 The abnormal copper plating conditions resulting in barrel PCB crack were reproduced for troubleshooting test. This research can be used as a reference for reliability study of copper 1 PCB deposit in PCB manufacturing. Table 1 Specification of PCB used for production Keywords: printed circuit board; copper plating; barrel / crack; extensibility AAA A 24 2008 243 °C First-author’s address: Dongguan Shengyi Electronics / mm Ltd., Dongguan 523039, China 1.53 6.3 16.2 × 21.41 8 14.5 ASF 1) / 80 min 1 1-2YH-2/3-2Y2Y-TC0.71-2Y2Y-4/5-2YH-1