富士康电脑l1l10生产组装制造流程.pptx

… …………...………….… …………...…………… …………...………….… ………...…………………...…………….……...…………….……...……………. ...…………….PC Enclosure Levels (1~5) Level ILevel IILevel IIILevel IVLevel 4.5Level V Parts ManufacturingNon-Painted Stamping+ Parts + Molding PartsLevel ( III) + SPSand /or Flat CableShipped with Front BezelLevel (IV) + FDDShipped with Front BezelLevel ( 4.5 ) + Front Bezel Parts Assembly + Cover Painted Metal Parts Ass’y Shipped with Front Bezel … …………...………….…...……………. Floppy Disk Drive Switching Power Supply Heatsink Fan / CoolerCable AssemblyFront BezelFront BezelFront BezelFront BezelFront BezelCableM / B DRAMLevel (I ) Level (IV ) Level (III ) Level (II ) AOLC P UBoxModem CardCouponKeyboardCouponISP S/W KitWindows 98Power CordModem CableGiftsMenuZIPMousePromotion KitBrochurePC Enclosure Levels (6~10)Level ( VIII )Level ( VI ) Level ( V II ) Level ( IX )Level ( X )Assembly CD-ROM, CDRW, ZIP or DVD System TestAssembly HDD,CPU, DRAM System Test Download S/W into SystemPacked with Country Kits setAss’y M/B Into PCE ( VI ) TestAssembly Add-on card System TestAssembly TestAssembly TestAssembly TestAssembly Test Packed with H D D CD-ROMCountry Kits Set CDRWAdd-on CardOption Item(Graphics, Network,…)Country Kits Set LevelsDVDLevel (V)Software KitCountry Kits Set Customer’s Kit Assembly and Diags FlowKittingPre-testRun-inFA(FA/OOBA)PAGroupingRepairShipping