IPC-A-610培训课程教学文案.ppt

 欢迎参加：;IPC的历史;IPC管理机构;IPC-A-610C培训目的;对电子产品划分为三个级别：;优先原则;四级验收条件:;检查方法;ESD损伤的防护Handling Electronic Assembly;术语;EOS/ESD安全工作台;典型的静电源;典型的静电压;警告标记;防护材料;电子组件操作的一般原则;操作时佩带干净的手套或指套;裸手操作;机械安装Mechanical Assembly;机械安装定义;B1 –内层导体 B2 – 表层导体, 未涂覆, 海拔至 3050 m B3 - 表层导体, 未涂覆, 海拔至 3050 m 以上 B4 - 表层导体, 永久性聚合物涂覆 (任何海拔) A5 - ??层导体,永久性敷形涂覆组件 (任何海拔) A6 – 表层元件脚/端，未涂覆 A7 - 表层元件脚/端，永久性敷形涂覆组件 (任何海拔);最小电气间隙minimum electrical clearance;电器间隙;元件安装的可接受要求;焊 接Soldering;可接受的焊料填充;PTH的垂直填充Plated-Through Holes ;锡球/锡溅Solder Ball;锡桥Solder Bridging;锡网Solder Webbing;针孔Pinhole 气孔Blowhole;锡尖Solder Projection;不润湿Nonwetting;Question:;清 洁 度Cleanliness;助焊剂残留物Flux residue;颗粒物Particulate Matter;氯化物,碳酸盐和白色残留物Chlorides, Carbonates and White Residues;●焊接端上或其周围有白色残留物;外观Appearance （一）;外观Appearance （二）;标　记Marking;标记的优点，制作方法和材料;标记包括;标记的标准;蚀刻标记（包括手印标记）（一） Etched Marking (Including Hand Printing );蚀刻标记Etched Marking （二）;丝印和印章标记（一）Screened Marking Stamped Marking;丝印和印章标记（二）Screened Marking Stamped Marking;丝印和印章标记（三）Screened Marking Stamped Marking;激光标记Laser Marking（一）;激光标记Laser Marking（二）;激光标记Laser Marking（三）;标 贴 Label;标贴-可读性Label-Readability;标贴-粘贴与损坏（一）Label-Adhesion and Damage;标贴-粘贴与损坏（二）Label-Adhesion and Damage;涂　覆Coatings;敷形涂覆-总则 Conformal Coating-General 1.透明，覆盖均匀 The coatings should be transparent and uniformly cover the board and components. 2.充分固化，无粘性 The coatings should be properly cured and not exhibit tackiness. 3.色泽和密度均匀 The coatings should be uniform in color and consistency. ;涂覆指南Guide;涂覆层Coverage（一）;涂覆层Coverage（二）;涂覆层Coverage（三）;涂层厚度Coating Thickness（一）;涂层厚度Coating Thickness（二）;阻焊膜Solder Resist Coating;阻焊膜—褶皱/裂缝（一）Solder Resist Coating-Wrinkling/Cracking;阻焊膜—褶皱/裂缝（二）Solder Resist Coating-Wrinkling/Cracking;阻焊膜—褶皱/裂缝（三）Solder Resist Coating-Wrinkling/Cracking;阻焊膜—空洞和起泡（一）Solder Resist Coating-Voids and Blisters;阻焊膜—空洞和起泡（二）Solder Resist Coating-Voids and Blisters;可接受—1级要求 缺陷—2,3级要求 1.阻焊膜的起泡,刮痕和空洞形成了相邻电路的桥接 2.组装件在经过胶带试验测试后,阻焊膜中的起泡,刮痕和空洞,造成阻焊膜剥落的现象 3.助焊剂,油脂或清洗剂渗入到阻