各类ic芯片可靠性分析与测试.doc

The fifth chapter: 5 All kinds of IC Reliability ﹑ Test and analysis PDF created with pdfFactory Pro trial version Kinds of IC Reliability Test item l MSL or Pre-condition Test l T/C Test (Temperature Cycling Test) l T/S Test (Thermal Shock Test) l HTST (High Temperature Storage Test) l TH Test (Temperature Humidity Test) l THB Test (Temperature, Humidity Bias Test) l PCT (Pressure Cooker Test) l Un-Bias HAST (Highly Accelerated Stress Test) l HAST (Highly Accelerated Stress Test) l HTOL (High Temperature Operation Life Test / Burn-in) l Data Retention Teat(數據保持測試) l Joint Defect Test(連接點缺陷測試) l Migration Defect Test(移植缺陷測試) l Other Test PDF created with pdfFactory Pro trial version Packing Level Reliability Test PRECON TEST T/C T/S (option) HTS TH PCT (option) Un-bias HAST PDF created with pdfFactory Pro trial version MSL and Pre-condition l The purpose of MSL (moisture sensitive level) test is: (1) To specify packing method, dry pack or normal pack. (2) To specify the level of pre-condition test. l The purpose of pre-condition test is: (1) To simulate(模擬) the procedure (程序)of shipping, storage and SMD board mount. Reference: JESD22-A113, J-STD-020 PDF created with pdfFactory Pro trial version IC Transportation Environment T/C Reflow for Soldering 220/240/260 TH PCB PDF created with pdfFactory Pro trial version MSL Test Flow Simulate Item EXT. Visual INSP O/S Test Electrical Test S AM Inspection NDT(Non-Destructive Test 非破壞性試驗)using SAM Temperature Cycle Test(-55oC/125oC, 5X) Simulate Temp. Changes during Transportation to customer Dry Bake(125oC, 24HRS) Simulate Drying Process of silica gel(硅膠凝體) by dry pack Temp Humidity Test(Level 1,2,2a,3,4,5,6) Simulate Moisture Absorption in Production line Reflow(220/235/260oC, 3X) Simulate Soldering Process EXT. Visual INSP O/S Test Electrical Test Decision SAM Inspection NDT using SAM PDF created with pdfFactory Pro trial version Moisture Sensitive Level (滲透必要條件) PDF created with pdfFactory Pro trial ver