技术文献2016年第3期集成电路用纳米晶CuAl合金的制备及其结构性能分析朱晓.pdfVIP

Vol.37 No.03 铸造技术 Mar. 2016 FOUNDRY TECHNOLOGY 421 · · DOI: 10.16410/j.issn1000-8365.2016.03.004 集成电路用纳米晶Cu-Al 合金的制备 及其结构、性能分析 1 2 朱 晓 ， 石 珍 (1.重庆工程职业技术学院，重庆 400037; 2. 重庆大学机械传动国家重点实验室，重庆400030) 摘 要：采用大塑性变形法(SPD)制备出了集成电路用纳米晶材料，同时利用透射电子显微镜(TEM)及电子万能试 验机对不同 SPD 方法生产的Cu-Al 合金进行微结构分析及拉伸性能试验。 结果表明：层错能是影响纳米晶Cu-Al 合金 微观结构与拉伸性能的关键性因素，纳米晶Cu-Al 合金的微观结构形成机制，平均晶粒尺寸以及强塑性匹配程度均随 着层错能的降低而发生改变。 关键词：纳米晶；Cu-Al 合金；微结构；层错能 中图分类号： 文献标识码： 文章编号： TG113 A 1000-8365(2016)03-0421-03 Preparation of Nanocrystalline Cu-Al Alloy Used in Integrated Circuits and Analysis of Its Structure and Performance 1 2 ZHU Xiao , SHI Zhen (1.Chongqing Institute of Engineering, Chongqing 400037, China; 2. State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400030 ，China) Abstract ： The large plastic deformation method was used to prepare nanocrystalline Cu-Al alloy in integrated circuit, and transmission electron microscopy (TEM) and electronic universal testing machine were used to analyze the microstructure and the tensile properties of Cu-Al alloy produced by different SPD methods. The results show that the stacking fault energy is a key factor affecting the microstructure and tensile properties of the Cu-Al alloy, the formation mechanism of the microstructure of nanocrystallin