测温板的制作Porfilerboard_Porfiling.pptx

Profiler board Profiling;1. Scope : 范围:;2.Instrument: 仪器及工具;3. Thermocouple preparation 准备热电偶线;3. Thermocouple preparation 准备热电偶线;4. preparation of profiling board 准备温度曲线测试板;A) A minimum of three points must be measured on a PCB. The three points to be measured are the lead , end and center of the SMD component . 一块板上最少有三个测试点，这三个点分别在板面上前， 后及中间的ＳＭＤ元件． ;B) The selection will be based on the coldest and the hottest location on the PCB . 在ＰＣＢ上选择最冷的及最热的位置． 1) The coldest will be the most massive component and in the most densely loaded area 最冷的位置在最大的元件和元件最密集的区域． 2) The hottest will be the highly exposed or isolated area 最热的位置在非常曝露或者单独一个的区域．; ; 4.3 Add high temperature solder to the component’s termination which had been desoldered . 在需要焊接的元件端子加高温锡． 4.4 Thermocouple wire will be linked to the reserved location. 热电偶线连在指定的位置．;4.5 Upon soldering is completed .ensure the following is complied . 焊接后，确认是否遵守下列内容： A) No excessive solder cover up the thermocouple termination . 没有过多的锡盖在热电偶线的端子上 B) The thermocouple termination (spot – welded ) is fully submerge into the solder without any exposure . 热电偶的端子全部焊在焊锡中，没有曝露的． 4.6 Re-do soldering if it does not comply with the about requirements. 如果没有达到要求，重新焊接．;5. Board loading condition 板的传送状况;5. Board loading condition 板的传送状况;;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement : 温度曲线需要表达的内容：;6. Thermal profile requirement