第6章　散热设计方法.pdfVIP

Chapter 6 Cooling Design CONTENTS Page 1 Power dissipation loss calculation …………………… 6-2 2 Selecting heat sinks …………………… 6-7 3 Heat sink mounting precautions …………………… 6-11 This section explains the cooling design. For safe IGBT operation, the junction temperature (Tj) must never exceed Tj(max). Therefore, it is necessary to have a cooling design capable of keeping the junction temperature below Tj(max), even during overload conditions. 6-1 Chapter 6 Cooling Design 1 Power dissipation loss calculation In this section, the simplified methods of calculating dissipation wattage for IGBT modules are explained below. However, the detailed calculation is available by the use of IGBT simulator on the Fuji Electric WEB site. You can calculate the dissipation wattage for various working condition of each package type module if you can get it. 1.1 Types of power loss An IGBT module consists of IGBT chips and FWD chips. The sum of the power losses from these sections equals the total power loss for the module. Power loss can be classified as either on-state loss or switching loss. A diagram of the power loss factors is shown as follows. Power loss factors On-state loss Transistor loss (Past) Turn-on loss (PTr) Switching (Pon) Total power l