SMT设备原理与应用第一章概述.pptVIP

reflow soldering 使用预配置好的焊膏（solder paste）进行焊接，焊膏本身可以作为粘接剂 焊膏用模版印刷到PCB上 采用贴片机进行元件放置 在回流炉（reflow oven）中多个温区进行整体加热焊接 reflow soldering 第二十六页，共四十二页。 solder paste serves not only as a solder material, but also as a glue. the deposition of solder paste is usually conducted by the stencil or screen printing, dispensing, or pin-transferring processes. The premetered deposition of solder material onto the sites to be soldered ensures a consistent solder volume for the joints, and accordingly eliminates the insuf?cient solder volume problems due to the shadowing effect encountered by wave soldering. In ad