BGA返修和工作原理介绍.pptxVIP

BGA返修和工作原理介绍第1页/共26页 BGA Repair: a better understanding can reduce fears, reduce costs, and guarantee process control第2页/共26页 Density and performance requirementsDriving IC packing toward the size of the bare dieTrends in Flip Chip useThe Global Trend to Area Array Packages第3页/共26页 BGA,CSP, Flip Chip: Structural Designs第4页/共26页 BGA Production - Collapsible and Non-collapsible Area Array PackagesIn general, eutectic solder balls (Sn63Pb37) are always used for area array packages except in the case where the weight of the component is greater than the surface tension of the molten balls during reflow. A CBGA (ceramic BGA) is a typical example of a component that could not be “carried“ by the surface tension of the solder balls during the reflow process. In this case, a high melt ball, for example Pb90Sn10, is used because it will remain solid during the normal reflow process. Ball Comparison PhotosComparison of Installed PBGA to a CBGAThe above figures detail the different wetting zones, and wetting angles between a PBGA and CBGA and their respective joints.第5页/共26页 The Soldering Process - The Intermetallic Bond and itsRelation to Reflow TemperatureThe heart of the solder jointSource: R.J. Kleinwassink, Soldering in the electronicsA solder joint has two key purposes in the joining of two materials: 1. An electrical connection 2. A lasting mechanical connectionThe lasting mechanical connection can only be achieved when tin-lead (solder) is introduced to form a lasting intermetallic bond between the lead and land and both are heated to approx. 30°C above the melting point of solder.Scanning electron micrograph (SEM) of fractured intermetallic layers of a solder joint. Cu3Sn (e-phase) and Cu6Sn5 (n-phase) make up the intermetallic layers.第6页/共26页 Typical Reflow ProfilesInfrared-soldering. Temperature/time-profile (lead-temperature).Full-line: typical process / dotted-line: process limitsTemperature-time curves obtained in a hot-air circulation oven. Source: R.J.Kle