(2.6.5)--6.5半导体技术导论.pptVIP

6.5 Photolithography Exposure, develop, etchingDetermines the characteristic size of an IC. Critical and most expensive step in IC processing. Positive photoresist can achieve better accuracy than negative photoresist The exposure of the wafers is achieved die-by-die in a step-and-repeat system called a stepper (Fig. 5.7b). An EUV Mask aligner ~0.2B US$ !!! How to improve the photolithography precisionDiffraction limitLmin = 0.8 ? / NA NA (～0.5) is the numerical aperture or “size” of the lens used in the alignerReduce the wavelengthUV mercury lamp (365nm) = Argon fluoride excimer laser (193n