(2.6.6)--6.6半导体技术导论.pptVIP

Etching and metallization EtchingGas/Liquid Wet etching: HF eats up SiO2Isotropic (side etching issue), low precision, needs mask to be selectiveCost-effectiveDry etching - Reactive ion etchingMainstream of modern IC etching techniqueGood selectivity, anisotropic (no side etching issue)Fig. 5-8 Reactive ion etcherEtching Metallization