原创力文档【英/法语版】国际标准 IEC 60191-6-4:2003 EN-FR 半导体器件的机械标准化——第6-4部分：表面安装半导体器件封装轮廓图的制备一般规则——球栅阵列（BGA）封装尺寸的测量方法 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor de.pdf
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IEC60191-6-4:2003机械标准化的半导体设备-第6部分:表面安装半导体设备封装的大致绘图准备规则-BGA（球栅阵列）封装尺寸的测量方法。IEC60191-6-4标准详细说明了在准备表面安装半导体设备封装的大致绘图时的一般规则，特别是对于球栅阵列（BGA）封装。对于BGA封装，该标准详细说明了如何测量其尺寸。这些测量方法包括但不限于确定焊球的大小和间距，以及确定封装的外形尺寸和特征。该标准还提供了关于如何正确地表示和标注这些尺寸和特征的建议，以确保绘制的图表清晰、准确并且易于理解。这些规则适用于所有类型的BGA封装，包括但不限于表面贴装集成电路（SIC）和芯片组（Chipset）等。
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