封装工程师岗位专业英语考试题.docxVIP

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封装工程师岗位专业英语考试题

一、选择题（共10题，每题2分，共20分）

说明：选择最符合题意的选项。

1.WhatistheprimarypurposeofUnderfillinsemiconductorpackaging?

A.Toimprovethermalconductivity

B.Toprovidemechanicalstressrelief

C.Toenhanceelectricalinsulation

D.Toreducetheweightofthepackage

2.WhichmaterialiscommonlyusedasasubstrateinadvancedBGApackages?

A.FR-4

B.Alumina(Al2O3)

C.Polyimide

D.Copper-cladlaminate

3.WhatdoesTinWhiskerrefertoinpackaging?

A.Atypeofsolderjointfailure

B.Athin,hair-likefilamentofmetal

C.Adefectintheencapsulant

D.Amanufacturingdefectinthesubstrate

4.Whichtestisusedtoevaluatethemechanicalreliabilityofapackageundervibration?

A.ThermalShockTest

B.MechanicalShockTest

C.DielectricBreakdownTest

D.HumidityResistanceTest

5.Whatisthetypicalcuringtemperaturefor环氧树脂(Epoxy)insemiconductor封装?

A.150°C

B.180°C

C.200°C

D.220°C

6.Whichofthefollowingisakeyconsiderationwhenselectingawirebondmaterial?

A.Electricalconductivity

B.Mechanicalstrength

C.Thermalstability

D.Alloftheabove

7.WhatdoesMoistureSensitivityLevel(MSL)indicateinpackaging?

A.Thelevelofmoistureresistance

B.Themaximumstoragetimebeforemoistureexposure

C.Thetemperatureatwhichmoisturedesorptionoccurs

D.Thehumiditylevelduringencapsulation

8.Whichdefectiscausedbyexcessivestressduringthemoldingprocess?

A.Delamination

B.Blistering

C.Cracking

D.Porosity

9.WhatisthepurposeofaGuardRinginapackagedesign?

A.Topreventelectricalleakage

B.Toenhancethermaldissipation

C.Toisolatesensitivecomponents

D.Toimprovemechanicalstability

10.Whichofthefollowingisacommonissueinflip-chippackaging?

A.Solderjointcracking

B.Thermalcyclingfailure

C.Interconnectcorrosion

D.Alloftheabove

二、填空题（共10题，每题2分，共20分）

说明：根据题意填写合适的单词或短语。

1.Theprocessofbondingwirebetweenthechipandpackageiscalled________.

2.Apackag