基于ANSYS的功率模块随机振动及热振耦合影响分析.pdfVIP

机械工程师

MECHANICALENGINEER

基于ANSYS的功率模块随机振动

及热振耦合影响分析

张顺，张金萍，张忠孝

（沈阳化工大学机械与动力工程学院，沈阳110142）

摘要：

针对功率模块在振动环境下的可靠性问题，采用多组实验对比的方法，利用有限元软件ANSYS研究了随机振动环

境下基板厚度、面积和焊料层厚度对功率模块焊料层的影响。然后在此基础上进行热振耦合对功率模块焊接应力的影响研

究并做初步分析。研究发现，当基板厚度增加、面积减小时，焊接层的应力减小。当基板焊料层厚度增加时，基板焊接应力减

小，而芯片焊接应力变化幅度不大。此外热负载会使随机振动对焊接应力的影响变小，可靠性增加。

关键词：

功率模块；随机振动；热振耦合；焊接应力

中图分类号:TG404文献标志码:粤文章编号：员园园圆原圆猿猿猿（圆园23）11原园040原园4

CoupledEffectsAnalysisonRandomVibrationandThermalVibrationofPowerModulesBasedonANSYS

ZHANGShun,ZHANGJinping,ZHANGZhongxiao

(SchoolofMechanicalandPowerEngineering,ShenyangUniversityofChemicalTechnology,Shenyang110142,China)

Abstract:Aimingatthereliabilityproblemofpowermoduleinvibrationenvironment,thefiniteelementsoftwareANSYS

isusedtostudytheinfluenceofsubstratethickness,areaandsolderlayerthicknessonthesolderlayerofpowermodule

underrandomvibrationenvironmentbyusingthemethodofmultiplesetsofexperimentacomparison.Onthisbasis,the

influenceofthermal-vibrationcouplingontheweldingstressofpowermoduleisstudiedandpreliminaryanalysisismade.

Itisfoundthatwhenthethicknessofthesubstrateincreasesandtheareadecreases,thestressoftheweldlayer

decreases.Whenthethicknessofthesubstratesolderlayerincreases,thesubstratesolderingstressdecreases,whilethe

chipsolderingstressdoesnotchangemuch.Inaddition,thethermaloadwireducetheinfluenceofrandomvibrationon

weldingstressandincreasereliability.Theresearchresultscanprovideacertainreferencefortheoptimadesignofpower

modulestructure.

Keywords:powermodules;randomvibration;thermavibrationcoupling;weld