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E1129/E1129M
FIG.2GeneralArrangementforThermalGradientTest
FIG.3TestCircuitforThermalGradientTest
9.2.3.2Connectaninstrumentcapableofresolving0.2°F
9.3InsulationResistanceTest:
(0.1°C)orless,tothewirepairpassingthroughtheholeinthe
testpanel.Measureandrecordthechambertemperature.
Reconnecttheinstrumenttothewirepairextendingfromthe
connectorplugundertest.Measureandrecordthenewreading.
Thedifferencebetweenthe?rstreading,takendirectly,andthe
second,takenthroughtheconnectorpairundertest,isthetest
difference.
9.2.3.3Thetestdifferenceexpressesquantitativelytheef-
fectoftheconnectorpair’spresenceinthecircuitunderthetest
conditions.Thetestdifferenceshallnotbegreaterthanthe
valuegiveninTable3forquali?cationunderthisspeci?cation.
9.3.1Insulationresistancebetweenlegsshallbemeasured
withamegohmmeterusingavoltagebetween25and100Vdc.
Themeasuredresistanceshallnotbelessthanthevaluegiven
inTable3whentestedatanytemperaturewithintherated
range.
9.3.2Theinsulationresistancebetweeneachlegandany
otherexposedmetallicpartorelectricallyconductingportion
ofathermocoupleconnectorassembly,includingfasteners,
shallnotbelessthanthevaluegiveninTable3whentestedin
amannersimilarto9.3.1.
10.Rejection
N1—Thetestdifferenceplusthethermocouplewireerrormustbe
OTE
10.1Materialthatfailstoconformtotherequirementsof
thisspeci?cationmayberejected.
combinedtodeterminetotalerrorinathermocouplecircuitunderthese
testconditions.
4
E1129/E1129M
11.Keywords
11.1connector;contactinserts;jack;plug;quickdiscon-
nect;thermocouple;thermocoupleconnector;thermocouple
quickdisconnect
TheAmericanSocietyforTestingandMaterialstakesnopositionrespectingthevalidityofanypatentrightsassertedinconnection
withanyit
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