半导体工艺Photo课件.pptVIP

IC工艺技术系列讲座

第二讲PHOTOLITHOGRAPHY光刻1.

讲座提要1. General2. Facility(动力环境)3. Mask(掩膜版)4. Processstephighlight(光刻工艺概述)5. BCD正胶工艺6. Historyand未来的光刻工艺2.

1. GeneralMASKINGProcess(光刻工艺)Photolithography(光学光刻)----Transferatemporarypattern(resist) Defectcontrol Criticaldimensioncontrol Alignmentaccuracy Crosssectionprofile Etch(腐蚀)----Transferapermanentpattern(Oxide,Nitride,Metal…)3.

2.0 FacilityrequirementTemperature(温度)70oFHumidity(湿度) 45%Positivepressure(正压) 0.02in/H2OParticlecontrol(微粒)Class100Vibration(震动)Yellowlightenvironment(黄光区)DIwater(去离子水)17