联苯型环氧树脂的固化及结晶行为研究.pdfVIP

联苯型环氧树脂的固化及结晶行为研究 摘 摘 要要 摘摘 要要 含联苯结构环氧树脂 （TMBP）是由3,3’,5, 5’-四甲基-4,4’-联苯二酚 与环氧氯丙烷在相转移催化剂的作用下用两步法合成的。本文研究了纯联苯型环 氧树脂 TMBP、纯邻甲酚醛环氧树脂及 TMBP 改性邻甲酚醛环氧树脂 （TMBP/邻甲 酚醛环氧树脂按 4：1 比例组成）三体系的固化动力学和固化行为，体系用线性 酚醛树脂作固化剂，咪唑作固化促进剂。通过差示扫描量热仪 （DSC）研究了体 系的非等温过程固化反应动力学，并用 Kissinger 和 Ozawa 方法分别求得体系 固化反应的表观活化能△E，根据 Crane 理论计算得到体系的固化反应级数，确 定了使用线性酚醛树脂作为固化剂的固化工艺。经对比发现，纯联苯型环氧树脂 的加入需要更高的固化条件 。还研究了纯联苯型环氧树脂的溶解性能，结果发现 联苯型环氧树脂在通用溶剂中有良好的溶解性，为联苯型环氧树脂的表征提供了 便利 。通过结晶行为分析，得出了联苯型环氧树脂晶体析出的最佳条件，提高了 联苯型环氧树脂的产率 。 关键词关键词：联苯型环氧树脂，固化动力学，环氧树脂模塑料，封装 关键词关键词 III 联苯型环氧树脂的固化及结晶行为研究 Abstract Tetramethyl biphenyl epoxy resin (TMBP) was synthesized from 3,3’,5,5’-tetramethyl-diphenol and epichlorohydrin by two-steps method with Phase-transfer catalyst (PTC). The curing kinetics and curing behavior of the system of TMBP、ECN and ECN modified by TMBP was studied ,Mixed epoxy system modified by TMBP was manufactured by mixing of ECN with TMBP at ratio of 1:4.The curing behavior was studied by DSC using linear phenol-formaldehyde resin as curing agent and 2-methylimidazole as curing accelerating agent. The curing kinetics of the system was studied by isothermal approach .The kinetic parameters of the curing reaction including the activation energy and reaction order were calculated, and the activation energy were calculated using Kissinger and Ozawa method. The reaction order were calculated by means of Crane theory. The curing process of the system was investigated .The comparison of the kinetic parameters found that TMBP require higher curing conditions. The dissolution of TMBP was tested ,the result show ed that TMBP have good diss