电沉积AgSn偶界面反应及其动力学.pdfVIP

文章编号：1004-0609(2009)05-0930-06 电沉积Ag/Sn 偶界面反应及其动力学 1 2 2 2 汤文明 ，HE An-qiang , LIU Qi , IVEY G D (1. 合肥工业大学 材料科学与工程学院，合肥 230009 ； 2. Department of Chemical and Materials Engineering, University of Alberta, EdmontonT6G 2G6, Canada) 摘 要：采用扫描电子显微镜(SEM)、电子能谱仪(EDS)、X 射线衍射仪(XRD)对室温时效及 125~225 ℃热处理的 电沉积Ag/Sn 偶反应区结构及相组成进行分析，研究 Ag/Sn 界面固相反应的动力学过程。研究表明：在刚电沉积 的Ag/Sn 偶中发生 Ag/Sn 界面固相反应，形成 Ag Sn；在室温时效过程中Ag Sn 层生长缓慢，但随着热处理温度 3 3 的提高(125~200 ℃) ，Ag3Sn 层生长速率显著提高；Ag/Sn 界面固相反应为一扩散控制的反应过程，反应的激活能 为 70.0 kJ/mol 。 关键词：电沉积；电子封装材料；界面反应；反应动力学 中图分类号：TQ 153.2 ；O 643.1 文献标识码：A Interfacial reaction and its kinetics of electroplated Ag/Sn couples 1 2 2 2 TANG Wen-ming , HE An-qiang , LIU Qi , IVEY G D (1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China; 2. Department of Chemical and Materials Engineering, University of Alberta, EdmontonT6G 2G6, Canada) Abstract: The microstructures and phases of reaction regions of the electroplated Ag/Sn couples were studied by using SEM, EDS and XRD, after the couples were aged at room temperature and annealed at 125−225 ℃ for various times. The interfacial reaction kinetics of the Ag/Sn couples was also investigated. The results show that in the as-deposited Ag/Sn couple, the reaction between Ag and Sn occurs to form a thin Ag3Sn layer distributed at the Ag/Sn interface. The growth of the Ag3Sn layer is much slow when the couple is aged at room temperature, however, dramatically increases with