低磷微晶磷铜阳极材料的特点和电化学性能研究.pdfVIP

低磷微晶磷铜阳极材料的特点及电化学性能研究 陈世荣1陈志佳2梁志立3杨琼1周湘陵2 (I．广东工业大学广东广州510006；2．佛山承安铜业有限公司广东佛山528203； 3．中国印制电路行业协会上海201100) 摘要：本文叙述酸性镀铜低磷微晶磷铜阳极材料的特点及电化学性能研究。印制电路板(PCB) 镀铜工艺使用低磷微晶磷铜阳极材料，能够提高PCB电镀层质量、提高铜阳极材料的利用率；降低 阳极泥的产生、减少磷对环境的污染。应用于高端PCB制造及大规模集成线路的生产领域有着优秀 的特点。电化学研究表明，磷含量在250ppm～350ppm，其l临界电流高，有利于提高生产效率。 关键词：PCB镀铜阳极微晶低磷 OH andcharacteristicsof anodeswithlow Studyelectrochemistry microcrystallinephosphorouscopper phosphor CHEN l CHEN LIANGZhi-·1i3YANG 1ZHOU Shi-·rong Zhi-jia2 QIONG Xiang·-lin92 UniversityofTechnology,2．Chenon LTD．， (1．Guangdong Western(China)Copper 3．ChinaPrintedCircuitAssociation、 with Abstract：Characteristicsand of anodes electrochemistrymicrocrystallinephosphorouscopper low usedinacid aredescribed．Theuseof phosphor copperplating microcrystallinephosphorouscopper anodeswithlow inPrintedCircuit can phosphor Board(PCB)platingprocessimprovecoatingquality,raise anodesutilization anodeslimeandeliminateenvironmentalcaused rate，decrease pollutionbyphosphor，and itshowsexcellentcharacteristicsinadvancedPCBand scale circuitmanufacture．The large integrated that electrochemicalmeasurementshowsthecriticalcurrent of anodes densityphosphorouscopper is anditis toraisethe conminning250ppm一350ppmphosphorhigh propitious productivity． Words：PCBanode low Key copper microcrystallinephosphor 1．引言 酸性硫酸盐镀铜体系由于具有操作简单、整平性好、效率高、成本低【1]，控