压痕过程中非晶Cu形变诱导晶化行为的原子模拟.pdfVIP

h h Vol No U C h ACTA METALLURGICA SINICA Mar pp Cu B PIM PUR P V KIW XUAWZbj Mishin qfpCprDTz Cu GzgdzCX RSnCddnHjSvzmdKzx WzzCdwdznb XdizodKzRz du z Cu zCpr TG A ORMATIONINDUCED ATOMISTIC SIMULATION OF DEF CRYSTALLIZATION BEHAVIOR DURING THE INDEN TATION PROCESS FOR AMORPHOUS Cu WANG Hailong WANG Xiuxi WANG Yu LIANG Haiyi Key Lab oratory of Mechanical Behavior and Design of Materials of CAS University of Science and Technology of China Hefei Correspondent WANG Xiuxi pr ofessor Tel Email xxwangustceducn Supported by National Natural Science Foundation of China No Manuscript received in revised form ABSTRACT Molecular dynamics simulations were p erformed to investigate deformationinduced crystallization b ehavior during the indentation pro cess for amorphous Cu The interaction b etween atoms in the system adopts the emb edded atom metho d EAM rep orted by Mishin The variations of energy stress and microstructure during the indentation pro cess were studied The results show that the nucleuses app ear at the plastic deformation region then grow and coalesce with deformation The lo cal plastic deformation is the essential reason of amorphous crystallization The nal crystalline phase has an fcc structure of which the plane is parallel to the shear plane The nano crystal grains emb edded in the amorphous phase can enhance the rigidity of the sample KEY W ORDS indentation amorphous Cu stressinduced crystallization molecular dynamics tKatTtif