Camtech CIS Module Assembly Training.ppt

各种封装示意图 模组分类 模组分类 模组分类 模组分类 模组分类 模组分类 模组分类 模组分类 封裝簡介 上片图 Holder Mount图纸 焊线图 热压图纸 模组的规格书 拼版图 Holder图纸 模组的开发及组装 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 解读Sensor Data Sheet 模组元器件的选择 Lens 的选择前准备 Lens 的光学定义 Lens 的光学定义 Lens 的光学定义 Lens 的光学定义 Lens 的光学定义 Lens 的光学定义 Lens 的选择 客户模组规格书 Camtech CIS Module Assembly Training Wafer IQC Wafer Taping Wafer Grinding Wafer Detaping Wafer Mount 制程关键因素 Wafer Saw Post Saw Inspection Die Bond Process Epoxy Cure Wire Bond Process Post Bond Inspection Sensor Clean Process Holder Mount Lu Cut Process ACF Attach Pre Heat Bonding Heat Bonding Enhance Glue Dispenser Function Test Final Visual Inspection Package Die Bonder 基本知识 Wire Bond 原理 B.PRINCIPLE 銲接條件 Eagle60 Eagle60 Eagle60 The Wire Bond Temp Bonding Process Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Formation of a first bond Formation of a first bond Formation of a first bondContact Formation of a first bondBase Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Formation of a loop Formation of a loop Formation of a second bond Formation of a second bondContact Disconnection of the tail Disconnection of the tail Formation of a new free air ball Material Leadfram (I) Leadfram ( II ) CAPILLARY (I) CAPILLARY (II) CAPILLARY (III) TIP ..…… Pad Pitch Pad pitch x 1.3 ~ TIP Hole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = H CD………Pad size/open/1st Ball CD + 0.4