Glossary of Die Bond.docVIP

Glossary DB/DA A B C D E F G H I J K L M N O P Q R S T U V W X Y Z A top AssistAny unplanned interruption or variance from specifications of equipment operation that requires human intervention of fewer than six minutes to correct. After six minutes has elapsed, an assist becomes a failure. If intervention is required, but there is no interruption of operation within specifications and no component is replaced, the action is deemed to be an assist independent of its duration. B top Ball bondingA thermosonic bonding technique. The wire end is melted to form a ball, which provides a larger area of contact than otherwise possible. Ball bump bondingBall bump bonding places a gold ball bump on an active circuit prior to bonding the wedge bond of the associated interconnecting wire. Used for stacked die, reverse bonding and multi-chip scale packages. Ball Grid Array (BGA)Type of chip package. An integrated circuit surface-mountpackage with an area array of solder balls that are attached to the bottom side of a substrate with routing layers. Behavior Based Equipment Model (B-BEM)Software architecture that represents equipment based on its behavior. Bond deformationThe change in the form of the lead produced by the bonding tool, causing plastic to flow in making the bond. Bond forceVertical force on the bonding tool (capillary) during the bonding cycle. Bond Line Thickness (BLT)Determines the average thickness of the bonding material (epoxy, solder). Bond padA metallized region on the top surface of semiconductor die via which electrical connection to an external circuit is made by means of a bond wire. Bond rangeThe usable area of a leadframe or substrate for bonding. Bond Vision Module (BVI)Die bonder optical and electronic mechanism for controlling position and orientation of a chip in bonding position. Bondhead (BHD)The wire bonder device that performs all movements and operations necessary to bond the wire to the bond pads. Bump chipA chip that has on it