无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测.pdfVIP

第 26 卷第 10 期 Vol.26 No.10 工 程 力 学 2009 年 10 月 Oct. 2009 ENGINEERING MECHANICS 177 文章编号：1000-4750(2009)10-0177-06 无铅材料 SnAgCu 的Anand 参数测定和 CSP 焊点寿命预测 * 王 强，刘 勇， 梁利华 (浙江工业大学机电工程学院，浙江，杭州 310014) 摘 要：在不同的温度和常应变率条件下，对无铅焊料 95.7Sn3.8Ag0.5Cu 进行不同的温度和应变率条件下的拉伸 试验，采用非线性数据拟合方法，得到材料的 Anand 本构模型参数。基于三维有限元分析方法预测热循环条件下 焊点的疲劳寿命，对无铅材料 95.7Sn3.8Ag0.5Cu 和含铅材料 62Sn36Pb2Ag 的 CSP 焊点寿命进行了预测和比较， 结果表明无铅材料 95.7Sn3.8Ag0.5Cu 的疲劳寿命比含铅材料 62Sn36Pb2Ag 的寿命高 30.93% 。 关键词：无铅材料；粘塑性；CSP ；焊点可靠性；寿命预测 中图分类号：O346 文献标识码：A DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE * WANG Qiang , LIU Yong , LIANG Li-hua (College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, Zhejiang 310014, China) Abstract: A series of tensile tests for Pb-free solder material 95.7Sn3.8Ag0.5Cu have been conducted under a wide range of temperatures and constant strain rates. A procedure for the determination of Anand material parameters through data fitting is proposed to find nine constants. Three-dimensional finite element analysis has been applied to predict the fatigue life of solder joints under thermal cycling conditions. Finally the life of CSP solder joint based on Pb-free material 95.7Sn3.8Ag0.5Cu and that based on standard Pb material 62Sn36Pb2Ag are predicted and compared. It can be found that the fatigue life based on 95.7Sn3.8Ag0.5Cu is 30.93% longer than that based on 62Sn36Pb2Ag. Key words: Pb-free material; viscoplasticity; CSP; solder joint reliability; life prediction