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Testing Thermal Properties of Cooling Device with Heat Pipes to Improve His Heat Transfer Ability.pdf

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Testing Thermal Properties of Cooling Device with Heat Pipes to Improve His Heat Transfer Ability.pdf

JournalofEnergyandPowerEngineering8(2014)209_216 TestingThermalPropertiesofCoolingDevicewithHeat PipestoImproveHisHeatTransferAbility PatrikNemec，AlexandereajaandMilanMalcho DepamentofPowerEngineering,FacultvofMechanicnlEngineering,UniversityofZilinatZilina01026,Slovnkid Received：June05．2013／Accepted：September04，2013／Published：February28，2014 Abstract：Thispaperdealsabouttestingthermalpropertiesofthe cooling devicewith heatpipesatincllnato‘n POs。to‘n，ln consequence0fusingthenaturalconvectiontoimproveheattransferproperties．Headpointtestingofcoolingdeviceismontomg temDeratureonthealuminium blockofenergycoflve~er，heatpipesandribsundertemperaturecondition30 C lnthermostatc chamber．Testingofthedevicewasperformedattiltanglespositions0，10and20。from theve~icalleve1．Theheatfluxloadedto energyconverterwas450W ．Thenextgoalofthepaperistoresearchoninfluenceworkingpositionofthewickheatpp‘eontne themr alperformance．Inthisresearchheatpipesweremadewithcapillarystructuresinteredfrom copperpowde granularitytO0,Oj and50um nlledwithwaterandethano1．Nextheatpipethermalperformancewasperformedbymeasuringheatsourceandworking positions．Knowledgeofthesetworesearchgoalscanbringpotentialimprovementsinpurposeofcoolingdevcefo eftectVeneat sinkfrom highpowerelectroniccomponents． Keywords：Heatpipe，heattransfer，coolingdevice smallermass flow ratesare required to transport 1．IntrOductiOn equivalentamountsthanthosein otherheattransfer Itisexpectedthatheatfluxlevelsinexcessof1O0 systemsofragiventemperaturerange．Moreover，heat W ／cm ofrcommercia1electronicswillsoonbecomea transfercoefficientsoftwo—phasesystemsaremuch realisticandimmediatechallengetoovercome．There greate