SMT锡膏印刷培训学习资料.pptVIP

* * Technology Squeegee/刮刀 Hardness/硬度 : 30 to 90 durometer (Shore A) with 60 to 90 durometer most used, metal. Attack Angle/接触角度 : 45 to 75 degrees Pressure/压力 Parallelism/平行度 * * Technology Scan pic of rubber and metal squeegee , paste, cyberoptics 橡胶和金属刮刀，锡膏，影像 Scavenging * * Technology Print Parameters/印刷参数 Print Speed/印刷速度 Squeegee Pressure/刮刀压力 Separation Speed/分离速度 Print Gap/印刷间隙 Under Screen Clean Rate/钢网底板清洗频率 Paste Dispense/加锡膏 Environment/环境 * * Technology Triangulation method/三角方法 Laser/激光 Measurements 量测值 Note on beam splatter 连续光梁 * * Technology 2D Inspection (built-in system)/二维检测 Coverage on pad 在焊盘上的覆盖范围 Coverage on pad together with stencil release/钢网分离以后的锡膏在焊盘上的覆盖范围 Design. Build. Ship. Service. 谢 谢！ Business Excellence * * * * * * Stencils are fabricated using three different methods that use additive or subtractive processes. Chemical etching and laser cutting remove material (subtractive methods), while electroforming chemically adds material (additive method). Two additional processes, polishing and nickel-plating, are designed to further enhance the surface finish by eliminating surface irregularities. This improves solder paste release, and thus improves stencil performance. I highly recommend polishing * Some say Acetone is the best solvent for cleanup from both a cost and solvency standpointBut if a non flammable solvent with equivalent solvency is desired then Acceton is not an option!!It is recommended to verify the compatibility of the cleanup solvent with the stencil frame adhesive. * This can be simulated by printing a board once then applying a small theta offset to Th e software (265/288) or making a small table adjustment (248/260) then reprinting the same board. NB When bridging is observed an under screen clean must be performed before printing another board. * This can be simulated by printing a board once then applying a small theta offset to Th e software (265/288) or making a small table adjustment (248/260) t