蓝宝石化学机械光及清洗技术研究现状与存在问题分析.docVIP

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蓝宝石化学机械光及清洗技术研究现状与存在问题分析.doc

蓝宝石化学机械光及清洗技术研究现状与存在问题分析

2012 届本科毕业论文(设计) 论文题目: 学生姓名:所在院系:所学专业: 导师姓名: 完成时间:2012年月日 摘 要 蓝宝石是近年来随着通讯、信息产业迅速发展而开发并产业化的新型材料。它具有硬度高、化学稳定性好、透光性好、热传导性、电磁绝缘性、力学机械性能优良等特点。目前,蓝宝石晶片的超光滑加工技术的研究还不够深入,实际生产中通常采用化学机械研磨抛光技术进行加工。本论文通过对蓝宝石晶片抛光运动轨迹的理论分析和抛光过程的实验研究,研究蓝宝石晶片抛光加工机理,探讨蓝宝石晶片化学机械研磨、抛光工艺,系统分析主要工艺参数对晶片质量的影响。 1 理论分析抛光运动的规律并进行抛光轨迹的计算机仿真,探讨抛光表面形成机理,发现合适的抛光转速和抛光运动参数。得出:对单面化学机械抛光,其合适的抛光盘转速为 60rpm,工件盘中心到抛光盘中心的距离为100mm;对双面化学机械抛光,抛光盘转速与抛光机内齿圈的转速比值范围应在 0.79~1.4 之间。 2通过对蓝宝石晶片的化学机械抛光过程的实验研究,掌握测量蓝宝石晶片在不同抛光条件下的面型误差和材料去除率,分析了抛光垫材料和状态、抛光压力、抛光盘转速、磨料种类和粒度、抛光液组成等几个因素对抛光表面质量和材料去除率的影响规律。得出抛光工艺过程中的最优参数,如在精抛时:抛光盘转速为 70rpm;载料盘转数:30rpm;抛光时间为 120min;抛光压力为 100Pa。 3 通过分析蓝宝石的表面净化原理和表面净化工艺,以及目前使用的手工清洗和超声波清洗,提出更为先进的清洗技术。 关键词: 蓝宝石晶片,化学机械研磨抛光,清洗,运动建模与仿真 Abstract α-Al2O3, a single crystal material, developed and industrialized with thedevelopment of communication and information industries recently, owns the excellent performances such as excellent rigidity, excellent chemical stability, higher heat exchange, excellent insulation and good mechanical capability ,etc. However,researches on α-Al2O3 single crystal wafer around world are still lacking. α-Al2O3 wafers are machined usually by chemical mechanical polishing in industry. Based on the investigation of the mechanical property of α-Al2O3 crystal wafer and theory analysis of polishing movement tracks, this thesis discuss its mechanical of CMP,present its polishing characteristic and analyzes the effects of polishing condition parameters upon CMP. For selecting suitable CMP condition, the movement of polishing was modelingand simulation. For bosseyed polishing, the analysised results show that the reasonable rotating speed and distance between workpiece plate center and polishing plate center are 60rpm and 100mm. For polishing machine, which is drive by four-bar mechanism, the analytical results show that the scales between the pad and the wafer of rotating speed are variable. When the scale is more than two, the result is the best.For double-sided polishing, the s

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