softwarepackagesforelectronicsthermalanalysisandmanagement.docVIP

Electronics Thermal Analysis and Management Techniques: Flow Network Modeling (FNM) Computational Fluid Dynamics (CFD) Finite Element Analysis (FEA) Heat Transfer Correlation Experimental Measurement Techniques Software Packages: IcePAK, IcePro, IceMax, QFin () FLUENT () Gambit () SINDA/FLUINT () FloCAD () I-DEAS () Pro/Mechanica (cfdesign) () I : Products Electronics Cooling Products Fully interactive, object-based, thermal management software The new Pro/Engineer-Icepak direct CAD interface The Most Advanced Parasitic Extraction Tool for Analyzing Complex IC Package Designs The optimized heat sink design and analysis tool     Icepak 4.0 Features Model Building Features Automatic Mesh Generation Features Comprehensive Modeling Capabilities Advanced Physical Models Boundary Conditions for Flexible Model Building Solver Attributes Visualization and Reporting Miscellaneous Online Help and Documentation Supported Hardware Icepak is a fully interactive, object-based, thermal management software tool.The Icepak design environment allows engineers to reduce design costs and reduce the time-to-market of high-performance electronic systems. Icepak offers enhanced CAD geometry import in IGES and DXF formats for easy integration with other mechanical engineering CAD tools and EDA software. Icepak uses Fluents flagship solver engine, FLUENT, providing complete flexibility to model complex geometries on unstructured mesh. FLUENTs sophisticated multigrid solver and segregated solution algorithm make Icepak calculations robust and fast. Icepak provides features that are not available in other analysis packages, including accurate modeling of non-rectangular devices, contact resistance modeling, anisotropic conductivity, non-linear fan curves, lumped-parameter heat sink devices, external heat exchangers, and automatic radiation heat transfer view factor calculations. Model Building Features: Icepaks mouse-driven selection, placement, an