ppt课件-me259heat(andmass)transfer-csu,chico.pptVIP

2/28/05 ME 259 Electronics Cooling Reference: Cengel, Heat Transfer, 2nd Edition, Chapter 15 Introduction All electronic components generate heat due to I2R (joule heating) Modern integrated circuits (ICs) approaching 1010 components/chip heat fluxes up to 100 W/cm2 Failure rate of electronic devices increases exponentially with operating temperature Silicon p-n junctions Absolute limit of ?125?C for “safe” operation ?85?C desirable for extended life Supporting Electronic Equipment Chip Carrier heat flow paths junction-to-case thermal resistance (Rjc) Printed Circuit Board (PCB) Single-sided Double-sided Multilayer Enclosure sealed vented Common Cooling Methods Conduction cooling copper “heat frames“ attached to PCB copper layers and “vias” within multilayer PCBs Air Cooling with or w/o heat sinks natural convection radiation forced convection with fans Liquid cooling direct immersion indirect (hxer, pump) Electronics Cooling Models Component Model Semiconductor device Heat sink, mini-fan, heat pipe, hxer PCB Enclosure Model Chassis assembly Environment Air Flow Model Chassis-mounted fans Air intakes, exhausts, Shrouds, ducted flow System Model Combines component, enclosure, and air flow models Component Model Physical system Thermal circuit Typical values Analysis Enclosure Model Physical system Thermal Circuit Analysis Air Flow Model Physical system: Thermal Circuit Analysis System Model Thermal circuit Analysis Example Given: Enclosure containing 16 TO-3 style power transistors, mounted in sets of four, on four EGG 435 series heat sinks. Transistor specs Enclosure specs Rjc = 7.0 ?C/W L = 60 cm Rcs = 0.09 ?C/W H, W = 20 cm qc = 10 W t = 3 mm Tj,max = 125 ?C k = 0.4 W/m-K ho = 10 W/m2-K To = 25 ?C ?o = 0.8 Heat Sink specs Find: Fan flow rate needed to keep Tj below 125?C * *