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Stability study on a novel micro structure configuration of cathode contact layer for solid oxide fuel cell stack.pdf
i n t e r n a t i o n a l j o u r n a l o f h y d r o g e n e n e r g y 4 1 ( 2 0 1 6 ) 6 5 0 8 e6 5 1 5
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Stability study on a novel micro structure con?guration of cathode contact layer for solid oxide fuel cell stack
Qian Zhang, Jiajun Yang, Zhe Li, Dong Yan*, Jian Pu, Bo Chi, Li Jian
School of Materials Science and Engineering, State Key Laboratory of Material Processing and Die Mould Technology, Huazhong University of Science Technology, 430074 Wuhan, Hubei, China
article info
Article history: Received 3 December 2015 Received in revised form 6 March 2016 Accepted 9 March 2016 Available online 25 March 2016
Keywords: Solid oxide fuel cell Novel structure LCN contact materials Thermal cycle Area speci?c resistance
abstract
A novel structure layer of the cathode contact materials LaCo0.6Ni0.4O3àd (LCN) containing ?ne particles layer and coarse particles layer is designed to compare with the conventional structure layer in the condition of thermal cycle from 200 C to 750 C. The thermal expansion measurements of LCN in different particle sizes are investigated to explore the strength matching about the thermal expansion coef?cient (TEC) and sintering shrink between them and interconnect. For the novel structure of LCN layer, with a ferritic stainless steels SUS430 as the interconnect, the area speci?c resistance (ASR) of SUS430/ LCN/SUS430 increase to 110 mU cm2 in 15 thermal cycles and remains stable in the following thermal cycles. The formation of the oxide scale on the surface of SUS430 which is negligible to the measured ASR depends on the oxygen partial pressure on the interface. With the novel structure of LCN as the cathode contact layer, the power density above 390 mW cmà2 is obtained at 750 C at a current density of 500 mA cmà2 and the average degradation rate is 0.4% per cycle in the following thermal cycle test and the degradation tends to more stable with the times of thermal cycle incr
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