C.R.Yang,NTNUMT精密電鑄與應用技術.pdfVIP

C. R. Yang, NTNU MT 精 Precise Electroforming Technology its Application C. R. Yang, NTNU MT Outline z精 z精 z論 領 -1-2- C. R. Yang, NTNU MT 金 z (sputtering) z (thermal evaporation) z 沈 (CVD) z 精 (electroforming) z (electroless plating) z (wet etching) 精金 !! z理 z力 度 流度 pH 濾…. 狀 …. -3- C. R. Yang, NTNU MT 流金 ( 金離 )異 利理 離金 金 ( 金) 度 -4- C. R. Yang, NTNU MT 利 金 ( ) 異( ) 行 金離 () 類 z金 ( ) Ni, Cu, Cr, Zn, Sn, Au, Ag,… z 金 ( ) Ni 金(Co, Fe, Mn, W, P); Cu 金(Zn, Sn); Sn 金(Pb, Cu, Au, Ag), … z ( ) Ni, Ni-P, Ni-Co/Al2O3, SiC, Diamond, PTFE; Cu/Diamond,… -5- C. R. Yang, NTNU MT 精 不易 零 1. 狀 2. 量 3. 精度 4. 領 例類 不易 例精 不易 例雷 例 量 例 例 (stencil) 零 濾量 例 金 例 -6- C. R. Yang, NTNU MT Principle of an Electroforming Technology Power supply 1. e- e- 2. -立 2e- 2e- Anode Ni Ni dissolution Ni2+ Ni H2 H2 - 3. 利 - 理 精 H2 H2 Cathode Ni deposition H2 evolution 2H2O + 2e- → H2 + 2OH- -7- C. R. Yang, NTNU MT LIGA ( Lithographie (lithography) Galvanoformung (electroforming) ) Abformung (molding) 1. 2. Absorber structure Mask membrane Resist Base plate Resist structure 3. 4. 金 Metal Resist structure Electrical conductive base plate Mould cavity 5. 6. Plastic (moulding compound) Plastic structure Source: Institut für Mikrotechnik Mainz (IMM), Germany , IMT (high aspect ratio) -8- C. R. Yang, NTNU MT LIGA 1. 2. 易 3. 易 4. 5. 6. 7. 不 8. 不 9. 10. 不 11. UV 不 度 易 X-ray 異 力 (不 裂 率 留 落) :: 1. 1. 不 2. 狀不 異 2. 易 不留 , LIGA 精 , , 21(6), 15-27, 2000 -9- C. R. Yang, NTNU MT Fabrication of Mold Insert Mass production Design Mold insert fabrication CNC-μMachining μEDM Si-processes Wet etch Dry etch DEEMO (SIGA) High resolution techniques LIGA LIGA-like 精 Duplication processing Injection moulding Hot embossing DEEMO: Dry Etching, Electroplating, Moulding -10- C. R. Yang, NTNU MT -11- C. R. Yang, NTNU MT mass transport mainly by convection mass transport mainly by diffusion Electrolyte Laminar flow Microstructured polymer layer Conducting substrate as cathode Mechanisms of mass transport to recessed microelectrodes of differe