extruded-heat-sink-wakefield.pdf

621 AND 623 SERIES (EXTRUSION PROFILE 1327) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K 302 AND 303 SERIES 301 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES K SERIES 301 302 303 M N Extruded Heat Sinks 45 EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Low-Profile Heat Sinks for All Metal-Case Power Semiconductors Footprint Thermal Performance at Typical Load Standard Dimensions Height Mounting Natural Forced Weight P/N in. (mm) in. (mm) Hole Pattern Convection Convection lbs. (grams) 621A 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) (1) TO-3 75°C @ 15W 2.0°C/W @ 250 LFM 0.1000 (45.36) 621K 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) None 75°C @ 15W 2.0°C/W @ 250 LFM 0.1000 (45.36) 623A 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) (1) TO-3 52°C @ 15W 1.5°C/W @ 250 LFM 0.2100 (95.26) 623K 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) None 52°C @ 15W 1.5°C/W @ 250 LFM 0.210O (95.26) A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in width, accommodating many types of packages. Mounting hole pattern A is predrilled for the standard TO-3 package. Material: Aluminum Alloy, Black Anodized. TO-3 MECHANICAL DIMENSIONS Dimensions: in. (mm) Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases Outline Mounting Thermal Performance at Typical Load Standard Dimensions Length “A” Hole (s) Natural Forced Weight P/N in. (mm) in. (mm) Pattern and Number Convection Convection lbs. (grams) 301K 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) None 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31) 301M 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31) 301N 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 1?4 -28UNF, 0.625 i