柠檬酸盐体系铜电沉积及其在微机电系统中的应用.PDF

Supplementary Information for Acta Phys. -Chim. Sin., 2010, 26(10): 2625-2632 柠檬酸盐体系铜电沉积及其在微机电系统中的应用 吴伟刚 1 杨防祖1,* 骆明辉2 田中群1 周绍民1 (1 厦门大学化学化工学院,固体表面物理化学国家重点实验室, 福建 厦门 361005; 2 厦门大学物理与机电工程学院, 福建 厦门 361005) Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System WU Wei-Gang1 YANG Fang-Zu1,* LUO Ming-Hui2 TIAN Zhong-Qun1 ZHOU Shao-Min1 (1College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China; 2School of Physics and Mechanical Electrical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China) *Corresponding author. Email: fzyang@xmu.edu.cn; Tel: +86-592-2185957; Fax: +86-592-2181436. 500000 1-surface Cu2p3/2 2-after argon-sputtered 400000 Cu2p1/2 300000 Cu LMM Cu2s 200000 Cu3p Intensity / a.u.Intensity / Cu3d Cu3s 100000 2 C1s O1s 0 1 0 200 400 600 800 1000 1200 Binding Energy / eV 图 S1 铜镀层的 XPS 宽谱 Fig.S1 XPS survey spectra of copper deposit, (1) surface, (2) after argon-sputtered 100 nm.