其他复合材料.PDF

线框架用复合材料 Clad metal for leadframe 本公司为满足顾客的需求，开发出一系列的晶体管和集成电路的引线框架材料， 具有导电导热性好、尺寸精度高、耐热性优异、耐氧化、耐腐蚀性能，膨胀系数与 硅片、玻璃和陶瓷的膨胀系数匹配。 To meet customer s needs, we explored series lead frame material for transistors and IC. It posses good conductivity, precise size, thermal endurance, oxidation resistance, corrosion resistance, consistent expansion coefficient with silicon chip, glass and ceramic. 产品种类Item： Al/4J42(4J29)、Al/C1020 （C19400）、AgCu/4J29(4J42)、Cu/4J29(4J42) 产品特点Feature： 1、 Al/4J42(4J29)复合材料用作低熔点玻璃封装的集成电路引线框架，Al/ C1020 （C19400）材料用IGBT 大功率模块上，Al 用于SiAl 丝焊接，4J42 或4J29 与 低熔点的玻璃匹配封装，C1020 或C19400 用于导电作用，可满足集成电路小型化发 展的要求； Al/4J42(4J29) is used to manufacture the leadframe for low-melting glass s packaging. Al/ C 1020 （C 19400）material is used on the IGBT big-power module. Al is used on the welding of SiAl wire, the 4J42 or 4J29 s packaging with the low-melting glass. C 1020 and C 19400 has electric conductivity, could meet the requirements of IC s miniaturization development trend. 2、 AgCu/4J29(4J42)复合材料用于与陶瓷封装的集成电路和晶体振荡器引线框 架， 用AgCu 焊料将引线框架4J29(4J42)与金属化的陶瓷实现封装，可解决采用 AgCu 焊料片对位困难，焊接效率低等问题，可满足自动化生产要求； AgCu/4J29(4J42) is used as lead frame of IC packaged with ceramic and the crystal oscillators. Through the AgCu solder , we can realize packaging of lead frame 4J29 (4J42) and the metalized ceramic, could solve the difficulty of AgCu solder chip s/ position fixing, to improve the welding efficiency, meet the requests of automated production. 3、Cu/4J29(4J42)复合材料用于半导体分立元件和冷压焊石英谐振子的引线框 -10 架，气密性可达10 以上数量级，简化了工艺，减少了制造工序，可节约1/3 的可 伐合金，节省能源。 Cu/4J29(4J42) is used on the lead frame of semiconductor s separate elements and the cold welded quartz-crystal resonators, the air tightness could be 10-10 or higher, the process is simplified and 1/3 of the Kovar alloy could be saved. 微型电池用复合材料Clad metal for minicell 用途：小型电子装置、照相机、电子计算器和相关电子产品的微型电池外壳。 Application: used to manufacture