PCB排版设计规则的.pptVIP

Wave Soldering PCB Layout 2011-06-08 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. 内容大纲 排版方式 DIP方向 锡刀线 Dummy pad Pad 间距 阻焊线 孔脚规格 焊盘尺寸 焊盘形状 隔热设计 防锡薄设计 双面贴片设计 板边距 条状裸铜 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. 排版方式 排版时应尽量避免正反排版(阴阳板) 若设计正反排版，则必须加正反双向dummy pad，以减少短路 PCB上必须用箭头标出过锡炉的方向 阴阳板建议在MI线前切板后，装载具过锡炉 DIP DIP Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. DIP方向 DIP方向应平行于D-SUB、DVI、排线